The devices' 32-bit DSP core provides the framework to develop algorithms for advanced audio and voice processing.
The new line of dual-mode Bluetooth audio products from Microchip Technology, the IS206X family, builds on the company’s IS202X portfolio of highly integrated system-on-a-chip (SoC) devices and modules by introducing Bluetooth Low Energy (BLE) capability. Uniquely engineered for speakers, headsets and gaming headphones, this flash-based platform offers ample flexibility and powerful design features, allowing audio manufacturers to easily incorporate wireless connectivity in streaming music and voice command applications.
A high-performance 32-bit digital signal processing (DSP) core provides the framework to develop sophisticated algorithms for advanced audio and voice processing. The 24-bit digital audio support delivers high resolution audio to consumers for a richer listening experience. Sound systems comprised of multiple Bluetooth speakers benefit from ultra-low latency audio streaming, resulting in tightly synchronised audio playback amongst each speaker. Applications such as professional headsets benefit from high definition voice, achieved with a robust implementation of 16kHz wideband voice with noise suppression and echo cancellation. The added firmware update capability allows for product software and configuration features enhancements over time.
Qualified for Bluetooth v4.2, the IS206X family supports Enhanced Data Rate (EDR) links and the standard audio profiles. The combination of BLE and Advanced Audio Distribution Profile (A2DP) enables smartphone-to-speaker communication via a mobile app. Customised apps enrich the consumer's experience by providing creative control features such as pairing, remote control and real-time audio effect adjustments.
The IS206X family is available in several offerings, allowing customers to tailor their wireless needs. For designs that require a turn-key solution for fast time-to-market, customers can take advantage of the chip's powerful features by choosing a module configuration with either a Class 1 or a Class 2 device. All modules are fully certified with the following regulatory bodies: United States (FCC) and Canada (IC), European Economic Area (CE), Korea (KCC), Taiwan (NCC) and Japan (MIC).