Infineon and Pmd claim the jointly developed iToF technology will enable enhanced interaction with the environment...
Pmdtechnologies, a provider of 3D depth sensors, has collaborated with Infineon Technologies to develop an advanced mechanism in 3D depth sensing for the upcoming Magic Leap 2 augmented-reality (AR) headset. The next generation of what Magic Leap calls “wearable computers” is expected to integrate the co-developed 3D indirect time-of-flight (iToF) depth-sensing technology.
The 3D iToF depth-sensing technology will be used in the next generation of Magic Leap, which targets industries such as health care, defense, and manufacturing. Advances in Magic Leap 2 are also expected to provide a more realistic and interactive environment for the adoption of AR technology for mission-critical tasks.
“Sensing the environment precisely and in real time is key for augmented-reality applications,” said Magic Leap CTO Julie Green. “Magic Leap 2 will provide an even more immersive user experience. These superior functionalities will help to connect the physical and digital world even more seamlessly.”
Infineon and Pmd claim the jointly developed iToF technology will enable enhanced interaction with the environment, as it helps create an accurate 3D mapping of the surroundings as well as 3D images of faces, hand details, and other objects in real time. The sensor also enables enhanced hand-gesture controls, making the interaction with the environment more realistic. It aims to reduce power consumption and heating, resulting in improved battery life for the overall system.
Pmdtechnologies’ 3D depth sensors are based on the ToF principle and aim to help a wide range of industries obtain real-time data about the environment. Face authentication for mobiles, gesture control and driver monitoring for cars, and mapping AR for robots are some of the applications made possible by this technology.
The Magic Leap 2 AR headset aims to help businesses streamline complicated processes, allowing workers to effortlessly communicate and empowering operators to operate more effectively. The 3D iToF depth-sensing technology built into Magic Leap 2 will be one of the key features enabling environmental sensing, providing more accurate real-time data with an immersive user experience.
The AR headset incorporates Infineon’s REAL3 3D image sensor chip IRS2877C. Additionally, the Magic Leap 2 AR headset will support interaction with the physical environment via the 3D imager’s on-board VGA resolution. Advances in 3D depth-sensing technology will pave the way for new applications, particularly in the medical sector to help surgeons gain a more detailed understanding of their patients’ anatomy.
“We have introduced our 3D imager technology in a professional environment, where precision and reliability are life-saving features,” said Andreas Urschitz, division president of power and sensor systems and designated CMO at Infineon. “The latest 3D time-of-flight technology is going to enable new augmented- and mixed-reality applications for health care and industry.”
This article was originally published on EE Times Europe.
Saumitra Jagdale is the founder of Open Cloudware and a contributing writer to AspenCore.