Power module shrinks to share heat sink with processors

Article By : Vivek Nanda

Linear's new power module can be mounted on the PCB backside and can share the heat sink with the on-board FPGA or processor.

Linear Technology Corp. has introduced the LTM4631, a dual 10A or single 20A µModule (power module) step-down regulator in an LGA package with a 16mm x 16mm footprint, reports EE Times Asia.

The ultrathin 1.91mm LTM4631 can be placed on a PC board close enough to its load, such as an FPGA, while sharing one heat sink covering both of their low-profile packages.

Read the rest of the story here.

Leave a comment