Power module shrinks to share heat sink with processors
Article By : Vivek Nanda
Linear's new power module can be mounted on the PCB backside and can share the heat sink with the on-board FPGA or processor.
Linear Technology Corp. has introduced the LTM4631, a dual 10A or single 20A µModule (power module) step-down regulator in an LGA package with a 16mm x 16mm footprint, reports EE Times Asia.
The ultrathin 1.91mm LTM4631 can be placed on a PC board close enough to its load, such as an FPGA, while sharing one heat sink covering both of their low-profile packages.
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