Article By : pSemi Corp.
pSemi Corp.’s UltraCMOS PE42424, a single-pole, double throw (SPDT) radio frequency (RF) switch, now supports the latest Wi-Fi 6E and ultra-wideband (UWB) standards and technology. Designed to enhance next-generation carrier and enterprise connectivity products, the PE42424 offers high linearity, fast switching and optimal isolation up to 8.5GHz. In a compact 1.5 x 1.5 mm form factor, it exceeds the power and performance requirements of 802.11ax Wi-Fi and ultra-wideband technologies.
Unlike Wi-Fi 6, which only supported devices that operated up to 6GHz, Wi-Fi 6E is extended up to 7.125GHz, providing more seamless connections, faster data rates and transmission accuracy to the wireless ecosystem. The PE42424 delivers a frequency range up to 8.5GHz to accommodate the increasing demand for reliable ultra-wideband technology, while remaining fully compliant for use in Wi-Fi 6 applications at 2.4GHz and 5GHz bands for maximum application flexibility.
“The semiconductor industry has seen a marked increase in device designers taking advantage of ultra-wideband technology, from location detection and radar to proximity sensing, and the extended frequency range of Wi-Fi 6E. pSemi has sold over 25 million units of the PE42424, and this high-performance switch will continue being an ideal solution for existing and emerging connectivity technologies, such as Wi-Fi 7,” said Vikas Choudhary, VP of sales and marketing at pSemi, a Murata company focused on semiconductor integration.
The PE42424 delivers high linearity levels of 61dBm IIP3 and 125dBm IIP2 and fast switching of 145ns at up to a 125kHz switching rate to ensure the highest levels of signal routing performance and transmit signal integrity in Wi-Fi 6E and ultra-wideband applications. Additionally, the switch provides exceptional off-port isolation levels of 48dB at 2.4GHz and 35dB at 5.8GHz and exceeds 31dB at 7.125GHz, enabling more reliable connections and additional spectrum capacity up to 8.5GHz.
The PE42424 is manufactured on the pSemi patented UltraCMOS process and offered in 6-lead, 1.5 x 1.5 mm DFN packaging. At nearly half the size of competitive product offerings, the switch’s compact form factor returns valuable board real estate back to the designers and system architects of next-generation connectivity products.