3d ic

2022-08-02 -

Deliver 3D IC innovations faster

Deliver 3D IC innovations fasterOne of the biggest semiconductor engineering challenges today is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To overcome these challenges, a growing number of companies are turning to heterogeneous integration and the 3D stacking of ICs and specialized chiplets (implemented in […]