2020-11-03 - CEA-Leti

CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies

CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...

2020-07-07 - Junko Yoshida

Engineers, It’s Time for the Expertise in Advanced Packaging

Arijit Raychowdhury, an expert in digital and mixed-signal design told that packaging is an area that process engineers must understand...