Siemens Acquires Avery Design Systems
Siemens is strengthening its IC verification portfolio with the acquisition of Avery Design Systems.
Synopsys Unveils Achievements on TSMC N3E Process
Synopsys' latest achievements in EDA and IP on the TSMC N3E process provide customers with robust solutions that help them…
Cadence Design Flows Now Certified for TSMC’s Latest N4P and N3E Processes
TSMC has certified Cadence's digital and custom/analog design flows for the latest N4P and N3E processes.
Cadence and Samsung Foundry Expand Collaboration to Advance 3D-IC Design
Through the continued collaboration, the reference flow featuring the Cadence Integrity 3D-IC platform has been enabled to advance Samsung Foundry's…
Cadence and Google Cloud Collaborating to Advance Chip Design Ecosystem
Cadence and Google Cloud are collaborating to accelerate system and semiconductor design with cloud-ready tools.
Cadence Accelerates Delivery, Enhances Quality of Arm Memory Products
With Cadence Liberate MX Trio, Arm achieved the accuracy and capacity required to address advanced-node memory characterization challenges.
Cadence and Tower Semiconductor Expand Collaboration to Accelerate Auto Chip Development
Cadence and Tower Semiconductor are collaborating to advance automotive and mobile IC development.
Siemens Expands Design Verification Functionalities of Calibre
Siemens has expanded the early design verification functionalities of its Calibre platform for IC physical verification.
Synopsys RF Design Solutions Enhance Productivity, Speed Design Closure on Samsung Foundry’s Low-power Process
The 8nm RF design reference flow enhances time-to-results, quality-of-results and cost-of-results for next-generation RF design.
Cadence Advances Comms Processing for Automotive, Consumer, and Industrial Markets
Cadence has expanded its Tensilica ConnX family with the debut of two new DSP IP cores for embedded processing in…