Defacto Launches Unified SoC Integration Platform
Due to the demand for more sophisticated applications, the design of systems-on-chip (SoC) is more and more complex.
Tessolve Raises $40M from Singapore-based Novo Tellus
The funding raised will be strategically deployed by Tessolve to strengthen their capabilities across chip design and embedded services offerings,…
Improving Circuit Performance Through Accurate Estimation of Manufacturing Variations
IC designers must account for the tiniest fluctuations in the nanoscale dimension to ensure that each of the billions of…
Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9%
Fabless IC company sales forecast to surge 22% in 2020 while IDM IC sales increase by only 6%.
What’s on Design Engineers’ Minds in 2020?
What’s on the design engineer’s mind in 2020, the year pundits claim will change the workplace forever with the option…
CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...
2021 Tech Trend Forecast: What does the Future hold?
TrendForce provides its forecast of key trends in the tech industry for 2021...
Neuromorphic Analog Processor for Always-on Smart Sensing Systems
Aspinity has raised $5.3 million in Series A funding to ramp up the deployment of ultra-low power always-on sensing...
5 Tips for Custom ASIC Design
When you decide on an ASIC. you still have plenty of other things to consider. Here they are.
India Doesn’t Need Its Own Fab
Observations from a technologist that transitioned into India’s IC design industry during the 90s.