2020-11-26 - George Leopold

Printed & Flexible Electronic Materials Find New Applications

Printed and flexible electronic materials used in smartphones are forecast to find new applications in medical devices and “smart packaging.”

2020-11-03 - CEA-Leti

CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies

CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...

2020-03-27 - Fendy Wang

Covid-19: More Closures Hit Asia

Our colleagues in China, Taiwan and other regions in Southeast Asia continue to report, from the ground, on the coronavirus's…

2019-11-12 - M. Di Paolo Emilio

The Importance of Thermal Management for Power Devices

The Cadence Celsius Thermal Solver is the first complete electric-thermal co-simulation solution for the entire hierarchy of electronic systems, from…

2019-07-16 - Rick Merritt

Chip Stacks in the Spotlight at Semicon

Chipmakers are turning to packaging to pick up some performance slack as traditional silicon scaling slows.

2019-07-10 - Rick Merritt

Intel Shows First Glimpse of Packaging Technologies on Roadmap

Intel's exascale supercomputer project may be the first to use one of three chip-stacking techniques Intel disclosed on its roadmap.

2019-01-23 - LEDinside

LED Packaging Companies Work on Niche Markets

Mainstream high- and mid-power LED package products in the Chinese market witnessed price declines in December, according to the latest…

2019-01-11 - Brian Santo, EE Times

Intel demonstrates 10nm Ice Lake CPU

Intel has demonstrated it's 10nm Ice Lake CPU at CES 2019, and promised that PCs incorporating this new processor will…

2017-09-28 - Rick Merritt, EE Times

Intel Refreshes Desktop CPUs

Intel rolled out six new desktop processors, boosting CPU frequency at the high end and adding more x86 cores elsewhere.