Samsung I-Cube4 Integrates 4 HBMs and Logic Die on Paper-thin Silicon Interposer
Samsung's I-Cube4 incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management as well…
Printed & Flexible Electronic Materials Find New Applications
Printed and flexible electronic materials used in smartphones are forecast to find new applications in medical devices and “smart packaging.”
CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...
Covid-19: More Closures Hit Asia
Our colleagues in China, Taiwan and other regions in Southeast Asia continue to report, from the ground, on the coronavirus's…
The Importance of Thermal Management for Power Devices
The Cadence Celsius Thermal Solver is the first complete electric-thermal co-simulation solution for the entire hierarchy of electronic systems, from…
Chip Stacks in the Spotlight at Semicon
Chipmakers are turning to packaging to pick up some performance slack as traditional silicon scaling slows.
Intel Shows First Glimpse of Packaging Technologies on Roadmap
Intel's exascale supercomputer project may be the first to use one of three chip-stacking techniques Intel disclosed on its roadmap.
LED Packaging Companies Work on Niche Markets
Mainstream high- and mid-power LED package products in the Chinese market witnessed price declines in December, according to the latest…
Intel demonstrates 10nm Ice Lake CPU
Intel has demonstrated it's 10nm Ice Lake CPU at CES 2019, and promised that PCs incorporating this new processor will…
Intel Refreshes Desktop CPUs
Intel rolled out six new desktop processors, boosting CPU frequency at the high end and adding more x86 cores elsewhere.