A research group has developed a transmitter that achieves a communication speed of 105Gbit/s using the frequency range from 290GHz…
A team of physicists from Kansas State University has found a way to mass-produce graphene by just using hydrocarbon gas,…
Researchers from Kyushu University have demonstrated a direct upconversion mechanism that allows naked eyes to "see" near infrared using a…
Arbor Technology’s BIOS ACT is designed to enable BIOS code recovery from a secondary on-board Flash and restart in case…
Researchers at Binghamton University have encrypted patient data using a person’s unique ECG as the key to lock and unlock…
Wafer-to-wafer bonding is a promising technique for enabling high-density integration of future ICs through 3D integration.
Silk's crystalline structure makes it one of nature's toughest materials, while fibroin can protect other materials while being fully biodegradable.
The technique provides a new way of inducing p-type electrical doping in organic semiconductor films, according to researchers.
Using a flexible prototyping platform from NI, engineers have implemented Massive MIMO, where 128 antennas are deployed at the base…
Researchers at the University of Buffalo have used a flourescent dye in a redox flow battery and predict generating 2.3V…